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Job Title


IC Package Design Engineer


Company : Technical Futures.


Location : Glasgow, Scotland


Created : 2025-11-17


Job Type : Full Time


Job Description

An IC Package Design Engineer with extensive hands-on experience using Cadence APD/SIP will join a thriving High Technology scale-up, enabling the build of scalable, energy efficient AI systems Worldwide.The IC Package Design Engineer will undertake all package design activities; ensuring cost effective methodologies are incorporated, completing verification of electrical characteristics of the paMake sure to read the full description below, and please apply immediately if you are confident you meet all the requirements.Please click on the apply button to read the full job description